If you’ve ever built your own PC you know how important it is to ensure the CPU and heatsink have a good thermal bond that is free of air bubbles. This requires the use of thermal paste/grease, which means spending some cash to get a decent brand or relying on whatever your heatsink shipped with. If overclocking is part of the plan, then scrape the manufacturer’s putty away and get yourself some Arctic Silver.The problem with using thermal compounds is they are messy and require a lot of trial and error to apply correctly. You also end up wasting quite a bit of it, and it’s not exactly cheap. However, Sony may be about to render them redundant with a new thermal conductive sheet it has developed.Sony Chemical & Information Device Corp. has demonstrated a thermal sheet that it claims matches thermal paste in terms of cooling ability while beating it on life span. The key to the sheet is a combination of silicon and carbon fibers, to produce a thermal conductive layer that’s between 0.3 and 2mm thick.Sony showed off the thermal sheet, known as EX20000C, during the Techno-Frontier 2012 event in Tokyo. The same CPU was cooled by thermal paste and the thermal sheet side-by-side, with the paste keeping the processor at a steady 53 degrees Celsius. The sheet achieved a slightly better 50 degrees Celsius. The actual CPU used in the demonstration wasn’t identified.If it matches paste on cooling and lasts longer, then both manufacturers and PC builders alike will surely make the switch. The sheet can be produced without any imperfections, will be a lot easier to use, and probably costs less to produce. At 0.3mm thick it’s also going to be thinner than even experts can achieve with thermal paste.Sony wants to get the thermal sheet used in servers and for projection units, but I can definitely see this being an option for typical PC builds, too.via Tech-On!